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Patent Searching and Data


Title:
RECYCLING METHOD OF SILVER-PLATED COPPER OR COPPER ALLOY SCRAP
Document Type and Number:
Japanese Patent JP2011140678
Kind Code:
A
Abstract:

To provide a recycling method in which silver-plating is safely and efficiently peeled in a short period of time from partially silver-plated copper or copper alloy scraps contaminated with oil and copper or copper alloy scraps from which silver-plating has been peeled are used as a raw material for manufacturing copper or copper alloy.

Partially surface-silver-plated copper or copper alloy scraps are degreased; silver-plated copper or copper alloy scraps after the degreasing are subjected to rust preventive treatment by adhesion of a rust preventive; silver-plated copper or copper alloy scraps after the rust preventive treatment are immersed in an electrolytic peeling solution containing at least one selected from aliphatic organic acids and salts thereof to thereby electrolytically peel the silver-plating; and copper or copper alloy scraps from which silver-plating has been peeled are used as a raw material for manufacturing copper or copper alloy.


Inventors:
SAKURAI TAKESHI
ISHIKAWA SEIICHI
KUBOTA KENJI
Application Number:
JP2010000509A
Publication Date:
July 21, 2011
Filing Date:
January 05, 2010
Export Citation:
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Assignee:
MITSUBISHI SHINDO KK
International Classes:
C25F5/00; B09B5/00; C22B1/00; C22B7/00; C22B15/00
Attorney, Agent or Firm:
Masakazu Aoyama