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Title:
REDUCED PRESSURE DRYING EQUIPMENT, SPREADING FILM FORMATION EQUIPMENT, AND REDUCED PRESSURE DRYING METHOD
Document Type and Number:
Japanese Patent JP2004047797
Kind Code:
A
Abstract:

To solve the problem that optimum setting of gas discharge flow rate is difficult since a form of a spreading film at a peripheral edge is deteriorated even if drying time is long and it is short when coating liquid like resist liquid spread on a substrate is subjected to reduced pressure drying.

After the substrate is carried in an airtight vessel, when pressure is reduced from atmospheric pressure to pressure, e.g. a pressure somewhat higher than vaporizing pressure of solvent, the solvent is evaporated violently from the spreading liquid. In this step, discharge is performed first on the basis of a first flow rate setting value Q1, and change of flow rate is performed to a second flow rate setting value greater than Q1 in the course of the discharge. By discharge with Q1, radius of surface at the peripheral edge is corrected, and component of the solvent is evaporated more briskly by change to Q2, however evaporation is enabled while the corrected form is maintained since the solvent is already evaporated to some extent and mobility of a coating liquid film is decreased.


Inventors:
KOBAYASHI SHINJI
KITANO TAKAHIRO
SUGIMOTO SHINICHI
Application Number:
JP2002204133A
Publication Date:
February 12, 2004
Filing Date:
July 12, 2002
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
B05C9/12; B05C11/08; B05D3/12; H01L21/00; B05D1/40; H01L21/027; B05D3/02; B05D3/04; (IPC1-7): H01L21/027; B05C9/12; B05C11/08; B05D1/40; B05D3/12
Attorney, Agent or Firm:
Toshio Inoue
Mizuno Hiromi