Title:
Reduction disposal method
Document Type and Number:
Japanese Patent JP6275230
Kind Code:
B2
Abstract:
To provide a flexible substrate processing apparatus which allows the stable reduction of an oxide contained in a film-like structure body formed on a flexible substrate. The apparatus has a substrate carrying-out portion where a flexible substrate on which a film-like structure body is formed is unwound; a reduction treatment portion where an oxide contained in the film-like structure body formed on the flexible substrate is electrochemically reduced; a washing portion where the flexible substrate and the film-like structure body are washed; a drying portion where the flexible substrate and the film-like structure body are dried; and a substrate carrying-in portion where the flexible substrate on which the film-like structure body is formed is taken up.
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Inventors:
Minoru Takahashi
Yumiko Yoneda
Momo Junpei
Keika Moriwaka
Naoto Kusumoto
Yumiko Yoneda
Momo Junpei
Keika Moriwaka
Naoto Kusumoto
Application Number:
JP2016223237A
Publication Date:
February 07, 2018
Filing Date:
November 16, 2016
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
C01B32/00; C23C26/00; C25B3/25; H01G11/36
Domestic Patent References:
| JP2003231990A | ||||
| JP2003176116A | ||||
| JP2005350749A | ||||
| JP5033195A | ||||
| JP2011021216A | ||||
| JP2003193293A | ||||
| JP2002033572A | ||||
| JP2011168449A |
Foreign References:
| WO2011074125A1 | ||||
| US20100303706 |