To provide a reference hole drill for multilayered printed board that can drill a through hole through a multilayered printed board having copper foil on its surface without producing any uncut part.
After the multilayered printed board 2 formed by covering a substrate 2b with the copper foil 2a is positioned and set on a drill stage 3a having pressure feet 8, a drill receiver 7 is positioned from the upside and set by prescribed pressure. The drill receiver 7 has a plate 7a having a guide hole 7c, an introducing port 6a through which compressed air 6 is forcibly blown into the receiver 7 from a pneumatic circuit 6b, and a dust collecting port 9 through which cutting chips are discharged to the outside together with the compressed air 6. The through hole is made through the printed board 2 by pressing the front end of the reference hole drill 3 against the copper foil 2a while the compressed air 6 is strongly blown toward the guide hole 7c from the introducing port 6a, and the drill 3 is raised in a rotating state. After the through hole is formed, the front end of the drill 3 is separated from the margin of the guide hole 7c.
TOTTORI YUKINORI
Next Patent: COMPOSITE ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD