Title:
REFLOW APPARATUS AND CONTROL METHOD FOR TEMPERATURE INSIDE OF REFLOW APPARATUS
Document Type and Number:
Japanese Patent JP3171179
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a reflow apparatus which corrects the difference in the temperature rise tendency of every electronic component on a printed-wiring board inside the reflow apparatus, by which every electronic component is soldered at a more uniform temperature distribution and which can enhance a mounting quality including the reliability of the component.
SOLUTION: In this reflow apparatus 10, a prescribed component 6 is soldered to a board 1 while the board 1 is being conveyed by a conveyance device 2 installed inside the reflow apparatus. Hot-blast guide means 5 by which a hot blast 11 from the reflow apparatus 10 is guided to a prescribed region on the board 1 inside the conveyance device 2 are installed. In addition, fans 4 by which the hot blast 11 from the reflow apparatus 10 is blown to the prescribed region on the board 1 inside the conveyance device 2 are installed.
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Inventors:
Genji Suzuki
Application Number:
JP1692599A
Publication Date:
May 28, 2001
Filing Date:
January 26, 1999
Export Citation:
Assignee:
NEC
International Classes:
B23K1/008; B23K1/012; B23K3/04; B23K31/02; H05K3/34; (IPC1-7): H05K3/34; B23K1/008; B23K3/04; B23K31/02
Domestic Patent References:
| JP8195550A | ||||
| JP10135623A | ||||
| JP5367839U | ||||
| JP499582U |
Attorney, Agent or Firm:
Yasuyuki Hata
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