Title:
REFLOW DEVICE, REFLOW METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2007125578
Kind Code:
A
Abstract:
To prevent the generation and scattering of a reaction product by corrosive action of an formic acid in a reflow device in which the formic acid is used to clean the surface of a soldering electrode.
A device for applying reflow treatment to a solder member formed on a substrate to be treated has a treating chamber and a formic acid introducing mechanism for introducing atmospheric gas containing the formic acid into the treating chamber. A shielding material consisting of a member having corrosion resistance to the formic acid is arranged between the reflow treating part of the treating chamber and the inner wall of the treating chamber.
Inventors:
MATSUI HIROYUKI
MATSUKI HIROHISA
OTAKE KOKI
MATSUKI HIROHISA
OTAKE KOKI
Application Number:
JP2005319819A
Publication Date:
May 24, 2007
Filing Date:
November 02, 2005
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
B23K1/00; B23K1/008; B23K31/02; H01L21/60; B23K101/42
Domestic Patent References:
| JP2001244618A | 2001-09-07 | |||
| JP2003243502A | 2003-08-29 | |||
| JP2001102158A | 2001-04-13 | |||
| JP2001176645A | 2001-06-29 | |||
| JPH0856071A | 1996-02-27 |
Attorney, Agent or Firm:
Tadahiko Ito