Title:
REFLOW DEVICE
Document Type and Number:
Japanese Patent JP2020120036
Kind Code:
A
Abstract:
To provide a reflow device that can perform soldering while suppressing a drop of flux liquid pool.SOLUTION: A reflow device includes a furnace body that melts solder paste applied to a printed circuit board that passes through the inside and performs soldering, a transfer unit that transfers the printed circuit board so as to pass through the inside of the furnace body, and a first concavo-convex ceiling plate 130 that is arranged inside the furnace body so as to cover at least a part of the upper portion of the transfer unit, and in which a concavo-convex portions 132 in which a linear concave portions 132a and a linear convex portions 132b that extend to intersect the conveyance direction D11 of the printed circuit board are alternately arranged are formed on the surface 131 facing the transfer unit.SELECTED DRAWING: Figure 2
Inventors:
SUGIYAMA KAZUKI
NOJIRI SHIGEYUKI
HATTORI KENICHI
NOJIRI SHIGEYUKI
HATTORI KENICHI
Application Number:
JP2019011167A
Publication Date:
August 06, 2020
Filing Date:
January 25, 2019
Export Citation:
Assignee:
YAZAKI CORP
International Classes:
H05K3/34; B23K1/00; B23K1/008; F27B9/10; F27B9/30
Domestic Patent References:
| JP2010118387A | 2010-05-27 | |||
| JP2018071336A | 2018-05-10 | |||
| JPH07252905A | 1995-10-03 | |||
| JP2014150122A | 2014-08-21 | |||
| JPH06188556A | 1994-07-08 | |||
| JP2001144426A | 2001-05-25 |
Attorney, Agent or Firm:
Fumio Takino
Toshiaki Tsuda
Yasuhiro Fukuda
Toshiaki Tsuda
Yasuhiro Fukuda