To transfer a printed wiring board from reflow equipment after cooling speed is increased for solder, which is heated and melted on the printed wiring board, so as to harden the solder, by providing a cooling panel whose surface is made of an infrared absorbing material so as to be opposed to a transfer path of the printed wire board in a cooling section.

In a cooling section 3, heat exchangers 7 are disposed on the upper and lower stages via a printed wire board 4. Further, an infrared absorbing material constituting the surfaces of the heat exchangers 7 absorbs heat radiated from the printed wiring board 4. An air blower 6 is disposed above the heat exchangers 7. The printed wiring board 4 is transferred to the cooling section 3 and melted solder is cooled. The melted solder is cooled and hardened so as to cover a circuit pattern and lead terminals of electronic components, so that soldered connection is completed. Subsequently, the printed wiring board 4 is transferred from a transfer hole 23, which is provided in the rear of the cooling section 3 to the outside of the reflow equipment 1.