To provide a reflow soldering device capable of raising the reflow soldering quality by reducing the heating cost, so as to reduce energy consumption in the reflow soldering device and to reduce the running cost, shortening the starting time of the reflow soldering device, so as to eliminate power supply in the reflow soldering device not in use and to reduce the waste of energy.
The reflow soldering device includes: a transporting part 1 for transporting a wiring board 4 with an electronic component mounted thereon via cream solder; a heating part 2 for heating the wiring board; and an inactive gas supplying part 3 for supplying inactive gas 19 to the heating part 2. A tube heater 5 using a gas combustion system is used for the heating part 2.
| WO/2014/139099 | SOLDERING SYSTEM |
HATTORI SHUJI
Hiroki Naito
Daisuke Nagano
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