Title:
REFLOWW SOLDERING PROCESS
Document Type and Number:
Japanese Patent JPS5436574
Kind Code:
A
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Inventors:
AONO SUSUMU
Application Number:
JP10158077A
Publication Date:
March 17, 1979
Filing Date:
August 26, 1977
Export Citation:
Assignee:
NIPPON AVIOTRONICS KK
International Classes:
H05K3/34; (IPC1-7): H05K3/34