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Patent Searching and Data


Title:
REFRIGERANT CIRCUIT UNIT AND HEAT PUMP DEVICE
Document Type and Number:
Japanese Patent JP2005172422
Kind Code:
A
Abstract:

To control an evaporation refrigerant amount supplied from a vapor injection device to a vapor injection port of a compressor to improve remarkably performance of a refrigerant circuit unit or a heat pump device.

In this heat pump device 22 provided with the first and second heat exchangers 34, 38 connected with a fluid each other, the scroll type compressor 28, and the vapor injection device 32, a flash tank 58 of the vapor injection device has an inlet 60 for a liquid refrigerant from the heat exchangers, a sub-cooled liquid refrigerant outlet 64 to the heat exchangers, and a vaporized refrigerant outlet 62 to a vapor injection port 48 of the scroll type compressor. An expansion valve 86 is provided to open and close the inlet of the flash tank by a float means to regulate a liquid refrigerant amount fed into the tank, so as to control a sub-cooled liquid refrigerant amount in the tank and the evaporation refrigerant amount supplied from the tank to the compressor.


Inventors:
HEALY JOHN J
WU MAN WAI
WANG SIMON YIREN
Application Number:
JP2004356194A
Publication Date:
June 30, 2005
Filing Date:
December 09, 2004
Export Citation:
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Assignee:
COPELAND CORP
International Classes:
F25B1/00; F25B1/04; F25B1/10; F25B41/04; F25B43/00; F25B49/00; F04C29/04; F25B13/00; (IPC1-7): F25B1/00; F25B1/04; F25B41/04; F25B43/00
Attorney, Agent or Firm:
Yoshiro Ishihara