Title:
冷凍装置
Document Type and Number:
Japanese Patent JP5842905
Kind Code:
B2
Abstract:
A refrigeration device (1) has: a high-voltage electrical parts group including a reactor (141 a to 141 c) and cooled elements (103, 142a to 142c, 143a to 143c, 106) that require cooling; a low-voltage electrical parts group; a printed wiring board (71); and a refrigerant jacket (29) that uses refrigerant flowing through a refrigerant circuit (10) to cool the cooled elements (103, 142a to 142c, 143a to 143c, 106). Additionally, here, the high-voltage electrical parts group including the reactor (141 a to 141c) and the low-voltage electrical parts group are mounted on one main surface (71 a) of a printed wiring board (71).
Inventors:
Fujiwara Masahide
Shinichi Ishizeki
Motonobu Ikeda
Shinichi Ishizeki
Motonobu Ikeda
Application Number:
JP2013265680A
Publication Date:
January 13, 2016
Filing Date:
December 24, 2013
Export Citation:
Assignee:
Daikin Industries, Ltd.
International Classes:
F25B1/00; F24F1/24
Domestic Patent References:
| JP2013224785A | ||||
| JP2011229364A | ||||
| JP6123449A | ||||
| JP2001275360A | ||||
| JP2011078309A |
Foreign References:
| US20120312046 | ||||
| US20130255932 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation