Title:
一体化されたバイパスシステムを備えている冷凍システム
Document Type and Number:
Japanese Patent JP2006519350
Kind Code:
A
Abstract:
A heat transfer system usable as an air conditioner, a heat pumpt or the like includes a compressor, a condenser, a main expansion device and an evaporator connected in a closed circuit through which a refrigerant is circulated, and a bypass device in which subcooling is performed rather than in the downstream portion of the condenser, as is conventional. The subcooling device is comprised of a unitary integrated structure having an inner tube connectable in a main refrigerant flow path at the outlet of a condenser, a concentric outer tube having end portions sealed to the outside of the inner tube thereby providing a chamber surrounding the inner tube, an inlet orifice connecting the inner tube to an upstream end of the outer tube that allows a portion of the refrigerant flowing in the inner tube to be diverted to the chamber, at a reduced temperature and pressure, an outlet orifice at the downstream end of the outer tube; and a return line in communication with the outlet orifice, and connectable to the main refrigerant path, whereby the diverted refrigerant can flow through the chamber, provide subcooling for refrigerant flowing in the inner tube, and then be returned to the main refrigerant flow path. The outlet orifice may also be sized to cause a pressure drop in the refrigerant as it exits the chamber, thereby accommodating a pressure differential between the refrigerant in the bypass device and the main refrigerant path at the point of reentry.
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Inventors:
Chorho By
Application Number:
JP2006501196A
Publication Date:
August 24, 2006
Filing Date:
February 25, 2004
Export Citation:
Assignee:
VIA Holdings LLC
International Classes:
F25B1/00; F25B5/02; F25B40/00; F25B40/02; F25B41/00; F28D7/10; F25B41/04
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro