Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
REINFORCED BINDING-WIRE BUNDLING MOLDING METHOD AND DEVICE THEREOF
Document Type and Number:
Japanese Patent JP3874886
Kind Code:
B
Abstract:

PROBLEM TO BE SOLVED: To provide a reinforced binding wire, in which the bent sections of central sections are slid and separated to a front or the side by the thumb of a left hand at every one or two strip by displacing the bent sections of the central sections little by little to both side section sides bundled into one at approximately every strip and forming the bent sections of the central sections in the bow shape of a boat when a commodity is manufactured by bending the central sections of a plurality of strips of weighed reinforced binding wires and bundling and uniting both side sections into one, a loop is formed easily and facility is improved.
SOLUTION: Both side sections 1a, 1a of a plurality of strips of reinforced binding wires 1 are received by receivers 2, 2 for weighing, the weight of the binding wires 1 is weighed, the central sections of the binding wires 1 are pushed, reciprocated and passed up to an inclined stopper 7 by a reciprocating inclined pin 5 between the receivers 2, 2 and between a pair of head-cut conical rollers 4, 4 having flanges 3 at front ends and the central sections of the binding wires 1 are bent, both side sections 1a, 1a of the bent sections are bundled, the inclined pin 5 is separated from the central sections after both side sections 1a, 1a are bundled 6, and the pin 5 is returned and moved to an original place.


Inventors:
Murakami, Mitsugi
Application Number:
JP1997000148128
Publication Date:
November 02, 2006
Filing Date:
June 05, 1997
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KIYUUTETSU SHOJI KK
International Classes:
E04C5/18; B65B27/00; E04G21/12; E04C5/18; B65B27/00; E04G21/12; (IPC1-7): E04C5/18; B65B27/00; E04G21/12



 
Previous Patent: DIE CUSHION DEVICE

Next Patent: FILTER CIRCUIT