Title:
REINFORCED FLEXIBLE PRINTED BOARD
Document Type and Number:
Japanese Patent JP2002289983
Kind Code:
A
Abstract:
To provide a reinforced flexible printed board in which the flexible printed board is not separated from a reinforcing board by the heat of soldering when mounted components are soldered.
The reinforced flexible printed board is made by placing the flexible printed board on the reinforcing board with a curing type adhesive which includes polyester resin, photocation polymeric compound having no boiling point and decomposed at 200°C or more or having a boiling point of 200°C or more, and a photocation polymerization starting agent and the weight of which is reduced by 10 weight % or less after curing. Preferably, to 100 parts by weight of polyester resin is added 10 to 100 parts by weight of the photocation polymeric compound.
Inventors:
YAGI MOTOHIRO
WATABE KOJI
NAKADA SHOICHI
WATABE KOJI
NAKADA SHOICHI
Application Number:
JP2001090671A
Publication Date:
October 04, 2002
Filing Date:
March 27, 2001
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B32B15/08; C09J4/00; C09J163/00; C09J167/00; H05K1/02; H05K1/03; (IPC1-7): H05K1/02; B32B15/08
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