Title:
REINFORCING METHOD OF METALLIC HOLLOW COLUMN
Document Type and Number:
Japanese Patent JP2009270401
Kind Code:
A
Abstract:
To fill and adhere a curing resin in a column, while leaving water as it is, in a method for reinforcing the column by removing the water left in the metallic hollow column with a lower end part embedded in concrete.
A hole is bored in the hollow column above an embedding part into the concrete. The curing resin having density higher than the water and superior in adhesion with a wetting surface, is injected from its hole. The staying water is made to flow out of the hole while substituting the staying water in the hollow column with the curing resin. The curing resin is filled up to the lower edge height of the bored hole, and the curing resin is made to adhere to the column.
Inventors:
Kitazawa, Hidehiro
Application Number:
JP2008000124419
Publication Date:
November 19, 2009
Filing Date:
May 12, 2008
Export Citation:
Assignee:
KONISHI CO LTD
International Classes:
E04G23/02; E01F15/02; E04G23/02; E01F15/02
Previous Patent: HEAT INSULATING REMODELED WALL
Next Patent: METHOD FOR BURYING HOLLOW PILE, AND BURIAL DEVICE FOR USE IN THE SAME
Next Patent: METHOD FOR BURYING HOLLOW PILE, AND BURIAL DEVICE FOR USE IN THE SAME
