Title:
補強用樹脂組成物、電子部品、電子部品の製造方法、実装構造体及び実装構造体の製造方法
Document Type and Number:
Japanese Patent JP7357195
Kind Code:
B2
Abstract:
A reinforcing resin composition includes an epoxy resin (A), a phenolic resin (B), and a benzoxazine compound (C).
Inventors:
Shigeru Yamazu
Yasuhiro Suzuki
Hirohisa Hino
Yasuhiro Suzuki
Hirohisa Hino
Application Number:
JP2018226757A
Publication Date:
October 06, 2023
Filing Date:
December 03, 2018
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
C08G59/40; C08G59/56; C08G59/62; H01L23/12; H05K3/28
Domestic Patent References:
| JP2006016576A |
Foreign References:
| WO2014203735A1 | ||||
| WO2018216229A1 |
Attorney, Agent or Firm:
Hokuto Patent Attorneys Office
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