Title:
リレー回路装置及びリレー回路装置の制御方法
Document Type and Number:
Japanese Patent JP7019501
Kind Code:
B2
Abstract:
To provide a relay circuit device capable of removing coating on the contact surface of each of a plurality of relays connected in series.SOLUTION: A relay circuit device includes: a load circuit having one end connected to a first node and the other end connected to a second node; a first relay having one end connected to the second node and the other end connected to a third node; a second relay having one end connected to the third node and the other end connected to a fourth node; a first capacitive circuit having one end connected to the first node and the other end connected to the second node; a second capacitive circuit having one end connected to the first node and the other end connected to the third node; and a control part for controlling the first and second relays. The control part controls the second relay to be turned on, and then controls the first relay to be turned on.SELECTED DRAWING: Figure 7
Inventors:
Teruo Kamakura
Mitsuhiro Furuya
Mitsuhiro Furuya
Application Number:
JP2018081598A
Publication Date:
February 15, 2022
Filing Date:
April 20, 2018
Export Citation:
Assignee:
Shindengen Industry Co., Ltd.
International Classes:
H01H47/00
Domestic Patent References:
| JP55096511A | ||||
| JP2013105550A | ||||
| JP52095074A |
Attorney, Agent or Firm:
Sakai International Patent Office
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