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Patent Searching and Data


Title:
中継端子モジュール
Document Type and Number:
Japanese Patent JP6894767
Kind Code:
B2
Abstract:
To provide a relay terminal module capable of improving measurement accuracy of temperature.SOLUTION: A relay terminal module 1 includes: a relay terminal 3 having a body 30 into which a terminal part on a power supply side and a terminal part on an electricity load side are inserted and in which the terminal parts are electrically connected to each other, and a housing part 40 formed integrally with the body; and a temperature detection part 5 housed in a housing part. The body may include a wall part 31a, and a spring part 32 which is arranged opposite to the wall part and by which the terminal part inserted into between the wall part and the spring part is pressed against the wall part. The housing part is provided at a position opposite to the spring part side with respect to the wall part and may be located near the wall part.SELECTED DRAWING: Figure 1

Inventors:
Hiraku Tanaka
Aki Sakamoto
Application Number:
JP2017110883A
Publication Date:
June 30, 2021
Filing Date:
June 05, 2017
Export Citation:
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Assignee:
Yazaki Corporation
International Classes:
H01R27/00; H01R9/28
Domestic Patent References:
JP9331615A
JP2014191953A
JP2006040704A
JP2000285986A
Attorney, Agent or Firm:
Toranomon Intellectual Property Office