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Patent Searching and Data


Title:
RELEASE FILM, COMPRESSION MOLDING METHOD, AND COMPRESSION MOLDING APPARATUS
Document Type and Number:
Japanese Patent JP2013230618
Kind Code:
A
Abstract:

To provide a release film that has excellent handling and excellent mold releasability, and is used for compression molding of a molding material; a compression molding method that can efficiently perform compression molding; and a compression molding apparatus that can efficiently mold.

When a molding material is performed by compression molding by a mold for a sealing material of an optical semiconductor element or a reflection frame material, or lens molding, a release film is used to be placed between the molding material and the mold, and the release film is characterized by having a silicone cured material layer to at least a surface to touch the molding material. In addition, a compression molding method uses the film, and a compression molding apparatus uses the film.


Inventors:
MORITA YOSHIJI
YOSHIDA SHIN
ENDO SHUJI
Application Number:
JP2012104071A
Publication Date:
November 14, 2013
Filing Date:
April 27, 2012
Export Citation:
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Assignee:
DOW CORNING TORAY CO LTD
International Classes:
B29C43/32; B29C33/68; B29C43/18; B32B27/00