Title:
RELEASE FILM
Document Type and Number:
Japanese Patent JP2008183738
Kind Code:
A
Abstract:
To provide a release film which is simple in composition and can appropriately be used when a flexible printed wiring board and a coverlay film are heat press-bonded together.
The release film which is a laminated film composed of fluorocarbon layers serving as outermost layers and an aliphatic polyamide resin layer as an intermediate layer is arranged on the coverlay film to be used when the flexible printed wiring board and the coverlay film are heat press-bonded together.
Inventors:
NISHIO YOSHIHIKO
Application Number:
JP2007016927A
Publication Date:
August 14, 2008
Filing Date:
January 26, 2007
Export Citation:
Assignee:
MITSUBISHI PLASTICS IND
International Classes:
B32B27/30; B32B27/00; B32B27/32; B32B27/34; H05K3/28
Attorney, Agent or Firm:
Tetsuro Hoshino
Akihiko Yamashita
Kishimoto Tatsuto
Akihiko Yamashita
Kishimoto Tatsuto
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