RELEASE LAYER-FORMING COMPOSITION AND METHOD FOR PRODUCING RELEASE FILM

Title:

RELEASE LAYER-FORMING COMPOSITION AND METHOD FOR PRODUCING RELEASE FILM

Document Type and Number:

Japanese Patent JP2023074464

Kind Code:

A

Abstract:

To provide a release layer-forming composition that has excellent releasability and excels in both of durability to a curing reaction of a photocurable resin and solvent resistance and a method for producing a release film.SOLUTION: A release layer-forming composition contains a melamine compound (A), a polyol with a molecular weight of 1500 or less (B1), a polyvinyl acetal (B2), an acid catalyst (C), and a hydroxy group-containing modified silicone resin (D), with the contents of the components (B1) and (B2) satisfying a specific relational expression. A method for producing a release film includes applying the release layer-forming composition to at least one side of a resin film, and then forming a release layer by heating.SELECTED DRAWING: None

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Inventors:

YOSHIKAWA ISAO
OKAMOTO YUKIO
NISHIMURA NAOYA

Application Number:

JP2022141765A

Publication Date:

May 29, 2023

Filing Date:

September 06, 2022

Export Citation:

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Assignee:

MITSUBISHI PAPER MILLS LTD

International Classes:

C08L61/28; B32B27/00; B32B27/30; B32B27/42; C08K5/053; C08L29/14; C08L67/00; C08L83/04; C09K3/00

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