Title:
RELEASE LAYER MATERIAL, SUBSTRATE STRUCTURE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING SUBSTRATE STRUCTURE
Document Type and Number:
Japanese Patent JP2010111853
Kind Code:
A
Abstract:
To provide a release layer material, a substrate structure including the same, and a method for manufacturing the substrate structure.
The release layer material applied in a flexible electronic device is a cyclic olefin copolymer (COC) having a specific structure. The substrate structure 10 includes a carrier 12, a release layer 14 covering the carrier with a first area in one or more blocks and containing the cyclic olefin copolymer (COC) of the specific structure, and a flexible substrate 16 covering the release layer and the carrier with a second area. The second area is larger than the first area, and the flexible substrate 16 has higher adhesiveness than that of the release layer 14 to the carrier 12.
Inventors:
LIAO HSUEH-YI
LEU CHYI-MING
SU CHUN-WEI
LEU CHYI-MING
SU CHUN-WEI
Application Number:
JP2009213651A
Publication Date:
May 20, 2010
Filing Date:
September 15, 2009
Export Citation:
Assignee:
IND TECH RES INST
International Classes:
C09J153/00; C08F210/02; C08F232/08; C08G73/10; C08K3/36; C08L101/00; C09J5/00; C09J7/00; G09F9/30
Domestic Patent References:
| JP2009040982A | 2009-02-26 | |||
| JP2009040982A | 2009-02-26 |
Attorney, Agent or Firm:
Hitoshi Maeda
Toru Suzuki
Hashimura Kazumasa
Horie
Yasunobu Funamoto
Toru Suzuki
Hashimura Kazumasa
Horie
Yasunobu Funamoto