Title:
離型紙剥離装置
Document Type and Number:
Japanese Patent JP7117701
Kind Code:
B2
Abstract:
To simplify the peeling process of release paper attached to a protective film.SOLUTION: A mold release paper peeling device includes: a holding part that holds a film which is adhered to a to-be-adhered portion via an adhesive surface with adhesiveness while the holding part is attached to a surface different from the adhesive surface of the film; a gripping part that grips an edge of a mold release paper which is an area adjacent to an area to which the film is adhered in the mold release paper adhered to the adhesive surface of the held film while the gripping part forms a valley-shaped recess in the surface to which the film is adhered in an edge of the mold release paper; and a peeling part that peels off the mold release paper from the held film by moving the gripping part that grips the edge of the mold release paper in a direction that separates the paper from the film.SELECTED DRAWING: Figure 11
Inventors:
Kazuyuki Tsumoto
Tokuoh Masahiko
Tokuoh Masahiko
Application Number:
JP2021095701A
Publication Date:
August 15, 2022
Filing Date:
June 08, 2021
Export Citation:
Assignee:
Toyota Motor Kyushu Co., Ltd.
Fukuji Co., Ltd.
Fukuji Co., Ltd.
International Classes:
B65H41/00; B60B7/00
Domestic Patent References:
| JP8259098A | ||||
| JP2008230737A | ||||
| JP2001287868A | ||||
| JP2005298140A | ||||
| JP2017034015A | ||||
| JP2008290727A | ||||
| JP2002114211A | ||||
| JP2005225082A |
Attorney, Agent or Firm:
Kenichiro Matsuo
Yasuo Ichikawa
Yasuo Ichikawa