Title:
RELEASE SHEET FOR HOT PRESS AND MANUFACTURING METHOD OF FLEXIBLE PRINTED WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2014208467
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a release sheet for hot press capable of easily being peeled without adhesive residue even after applying hot press working in manufacturing a flexible printed wiring board with a two-layer CCL structure.SOLUTION: The release sheet for hot press contains an adhesive layer on one side of a base material film, and the adhesive layer has a glass transition temperature of 10°C to 45°C and is formed from at least (A) an acrylic resin and (B) a crosslinking agent, (A) the acrylic resin is a copolymer of (A-1) ethyl methacrylate, (A-2) (meth)acrylate having a functional group and an alkyl group having 2 to 8 carbon atoms, and (A-3) a monomer having an ethylenic unsaturated double bond.
Inventors:
UEHARA MISAKI
NAKAYAMA MASANORI
NAKAYAMA MASANORI
Application Number:
JP2014061673A
Publication Date:
November 06, 2014
Filing Date:
March 25, 2014
Export Citation:
Assignee:
SOMAR CORP
International Classes:
B29C43/32; B29C33/68; B32B15/08; B32B27/00; B32B27/16; B32B27/30; C09J7/02; C09J11/06; C09J131/04; C09J133/08; C09J133/10; C09J133/14; C09J133/20; C09J175/04; H05K1/02; H05K3/28
Domestic Patent References:
| JPH0770539A | 1995-03-14 | |||
| JP3381211B2 | 2003-02-24 | |||
| JP4890539B2 | 2012-03-07 |