Title:
RELEASE TREATMENT AGENT
Document Type and Number:
Japanese Patent JP3795478
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a release treatment agent having an excellent heat resistance, wherein the stripping power hardly decreases even if the agent is left at a high temperature and the agent does not easily migrate into an adhesive layer.
SOLUTION: This release treatment agent comprises a vinyl-based polymer (A) consisting of a major unit, of a long chain alkyl(meth)acrylate ester unit represented by formula (I), wherein Mw is 10,000-800,000 and Mw/Mn is ≤4.5. In formula (I), R1 is hydrogen atom or methyl group and R2 is a long chain alkyl group having at least 12C.
Inventors:
Shoji Ohgido
Hiroyuki Komatsu
Hiroyuki Komatsu
Application Number:
JP2003192374A
Publication Date:
July 12, 2006
Filing Date:
July 04, 2003
Export Citation:
Assignee:
Shin Nakamura Chemical Co., Ltd.
International Classes:
C09K3/00; C09J7/02; (IPC1-7): C09K3/00; C09J7/02
Domestic Patent References:
| JP2000290610A | ||||
| JP2001240775A | ||||
| JP2000273406A | ||||
| JP2000160117A | ||||
| JP11349774A |
Attorney, Agent or Firm:
Takashima Ichi