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Title:
RELEASED MATERIAL-REDUCED, IMPACT RESISTANCE-IMPROVED POLYOXYMETHYLENE MOLDING MATERIAL, USE THEREOF AND MOLDED ARTICLE PRODUCED THEREFROM
Document Type and Number:
Japanese Patent JP2012237010
Kind Code:
A
Abstract:

To provide a molding material which holds the levels of mechanical characteristics, especially impact resistance and resilience, and is simultaneously substantially low in the release of formaldehyde.

The polyoxymethylene molding material comprises (A): 0.01-1.0 wt.% of a cyclic stabilizer containing at least one nitrogen atom in the ring; (B) 0.001-0.5 wt.% of a carboxylate; (C): 5-50 wt.% of an impact resistance-improving agent; (D): 0.0-2.0 wt.% of a steric hindrance phenol compound; (E): 0.0-1.0 wt.% of at least one stabilizer originated from the group of benzotriazole derivatives, benzophenone derivatives, and aromatic benzoate derivatives; (F): 0.0-0.8 wt.% of a steric hindrance amine (HALS) acting as a photostabilizer, and (G): the remaining amount of polyoxymethylene polymer.


Inventors:
DISCH STEFAN
WITAN KURT
HOFMANN ERNST
KURZ KLAUS
Application Number:
JP2012178198A
Publication Date:
December 06, 2012
Filing Date:
August 10, 2012
Export Citation:
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Assignee:
TICONA GMBH
International Classes:
C08L59/00; C08K5/07; C08K5/098; C08K5/10; C08K5/101; C08K5/103; C08K5/13; C08K5/16; C08K5/34; C08K5/47; C08L51/04; C08L59/02; C08L59/04
Domestic Patent References:
JPS60219253A1985-11-01
JP2000086738A2000-03-28
JPH04145114A1992-05-19
JP2004510024A2004-04-02
JPH05156118A1993-06-22
JPH06136234A1994-05-17
JPH07268180A1995-10-17
JPH07316393A1995-12-05
JP2000026705A2000-01-25
Foreign References:
WO1997012937A11997-04-10
Attorney, Agent or Firm:
Shinjiro Ono
Yasushi Kobayashi
Hiroyuki Tomita
Osamu Hoshino
Okimoto Kazuaki