To provide a releasing method and device of work equipped with an adhesive-coated tape for preventing the damage etc. of a work such as a semiconductor wafer when releasing the semiconductor wafer on which a dicing adhesive tape is stuck, i.e., work with an adhesive-coated tape from a holding member for sucking and holding the semiconductor wafer, after being subjected to the so-called mount exfoliation processing of exfoliating a surface protective tape on the surface of the semiconductor wafer after a rear surface polishing processing is completed, and it is placed and held on the holding member for sucking and holding a face of the dicing adhesive tape stuck for its being cut (dicing) to chips.

The releasing method releases the work 29 equipped with adhesive-coated tape from the holding member 30 for sucking and holding the work 29 with the adhesive-coated tape. In the method, the work 29 equipped with the adhesive-coated tape is released from the holding member 30 while supplying gas between the work 29 with the adhesive-coated tape and the holding member 30 so as to reduce the holding force of the holding member 30.