Title:
孔あけ加工用当て板及び孔あけ加工方法
Document Type and Number:
Japanese Patent JP4856511
Kind Code:
B2
Abstract:
The support board for perforation processing 1 of the present invention having a lubrication layer 3 formed on at least one surface of an aluminum substrate 2 is characterized in that the lubrication layer 3 is made of a mixture containing water-soluble resin and amino acid. This structure provides a support board for perforation processing having a lubrication layer excellent in adherence to an aluminum substrate, free from stickiness, and excellent in blocking prevention, and capable of easily being washed after processing.
Inventors:
Shingo Kaburagi
Nokazu Uda
Koji Okura
Yasuyuki Uraki
Tatsuhiro Mizo
Nokazu Uda
Koji Okura
Yasuyuki Uraki
Tatsuhiro Mizo
Application Number:
JP2006279025A
Publication Date:
January 18, 2012
Filing Date:
October 12, 2006
Export Citation:
Assignee:
Daichi Chemical Industry Co., Ltd.
Showa Denko Packaging Co., Ltd.
SHOWA DENKO K.K.
Showa Denko Packaging Co., Ltd.
SHOWA DENKO K.K.
International Classes:
H05K3/00; B26F1/16
Domestic Patent References:
| JP2000218599A | ||||
| JP2001146600A | ||||
| JP2006181657A | ||||
| JP2003225892A | ||||
| JP2003175412A | ||||
| JP2006181656A |
Attorney, Agent or Firm:
Hisayoshi Shimizu
Ken Takada
Yoshihito Shimizu
Ken Takada
Yoshihito Shimizu