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Title:
REMOVAL COMPOSITION FOR REMOVING ADHESIVE
Document Type and Number:
Japanese Patent JP2009149743
Kind Code:
A
Abstract:

To provide a removal composition for adhesive removal, capable of speedily removing an adhesive.

The removal composition for removing an adhesive contains at least one of a ketone type solvent and a nonionic surfactant.


Inventors:
IMAI HIROFUMI
MISUMI KOICHI
OGATA HISAYUKI
ASAI TAKAHIRO
TAKAHASHI MOTOKI
Application Number:
JP2007327752A
Publication Date:
July 09, 2009
Filing Date:
December 19, 2007
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
C09D9/00; C09D9/04; C09J5/00
Attorney, Agent or Firm:
Kenzo Hara International Patent Office