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Patent Searching and Data


Title:
REMOVAL OF MOLD RELEASE AGENT
Document Type and Number:
Japanese Patent JPH03190711
Kind Code:
A
Abstract:

PURPOSE: To avoid the use of an organic solvent for removing a mold release agent by pressing a rotating rubber roller against the surfaces of resin moldings, to which the mold release agent adheres, and cleaning the surfaces of the moldings to remove tailings generated from the mold release agent in the title removal for transfer moldings and the like.

CONSTITUTION: Transfer moldings 1 are conveyed by a covering rail 2 in the state that the surfaces of said moldings, to which a mold release agent adheres, face upward. On the way of conveyance, a rotating rubber roller 5 is pressed against the surfaces. In this case, a rotational speed of the surface of the rubber roller 5 is made different from a moving speed of the conveying rail 2 so that the mold release agent that adheres to the moldings 1 is scraped off by the rubber roller 5. The moldings 1 from which the mold release agent is scraped off are then sent to a cleaning chamber 6 to be cleaned by compressed air or by flowing water. According to this constitution, the mold release agent can be removed without using an organic solvent.


Inventors:
KIKUCHI TAKEO
Application Number:
JP33151089A
Publication Date:
August 20, 1991
Filing Date:
December 21, 1989
Export Citation:
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Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L21/56; B29C33/58; B29C37/00; B29L31/34; (IPC1-7): B29C33/58; B29C37/00; B29L31/34; H01L21/56
Attorney, Agent or Firm:
Iwao Yamaguchi