To provide a remover which can remove a photoresist film or an etching resistant resin composition film remaining on the surface of a substrate after etching in a short time, does not cause the tarnish and corrosion of a metallic material used as the substrate and ensures easy washing work and easy waste water treatment because the remover does not use a chelating agent and is less liable to cause foaming in washing and in waste water treatment.

The remover consists of 1-10 wt.% one or more selected from polyols and their derivatives, 0.001-0.1 wt.% one or more selected from anionic surfactants, nonionic surfactants and fluorine-containing surfactants, 5-40 wt.% alkali hydroxide and the balance water.