To remove a protective tape without breaking a wafer by suppressing peeling force concentrating when the protective tape begins to be peeled.

A removing device 100 has a peeling tape unit 20. The unit 20 lowers guide rollers 12 and 14 to stick the peeling tape H on a top surface of the protective tape, having a cut reaching an edge of the semiconductor wafer W, within a range including the cut. Further, the unit 20 moves the guide roller 12 toward the guide roller 14 to draw the peeling tape so that the protective tape united with the peeling tape H is peeled from the edge of the semiconductor wafer W on both sides of the cut. The protective tape begins to be peeled at two places on both the sides of the edge Ca of the wafer W. The place where the protective tape begins to be peeled can be dispersed to the two places, so when the protective tape is peeled, the peeling force applied to the wafer can be dispersed and the wafer is not broken.