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Patent Searching and Data


Title:
REPLICATING MOLD
Document Type and Number:
Japanese Patent JP2012166496
Kind Code:
A
Abstract:

To provide a replicating mold that can transfer unevenness on a main surface 11 of an electroforming layer in a replicating mold 100 by uniform press pressure even when there is unevenness on the opposite surface 12 of the electroforming layer in imprint molding for transferring to a UV curable resin or a thermoplastic resin.

The replicating mold includes: the electroforming layer 10 separated from a matrix 40 after growing electroforming on a main surface 41 of the matrix from the matrix 40 having the main surface 41 of the matrix having an unevenness shape; and a buffer layer 20 arranged on the opposite surface 12 of the electroforming layer positioned to face the surface contacting the main surface 41 of the matrix of the electroforming layer 10. The buffer layer 20 allows pressure uniformization of a press in imprint molding by using the replicating mold 100.


Inventors:
SAITO ATSUSHI
Application Number:
JP2011030543A
Publication Date:
September 06, 2012
Filing Date:
February 16, 2011
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B29C33/38; C25D1/00
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Kazuhiko Miyasaka