Title:
RESIDUAL STRESS MEASURING DEVICE AND RESIDUAL STRESS MEASURING METHOD
Document Type and Number:
Japanese Patent JP2007212141
Kind Code:
A
Abstract:
To provide a residual stress measuring device and a method therefor capable of determining a residual stress of a film from an extremely simple balance condition of moment by measuring the swelling amount of an exfoliated film and by determining a residual stress in the film from the shape by computing.
This residual stress measuring device 1 has a constitution equipped with a pulse laser device 2 for emitting a pulse laser, an optical system 3 for condensing pulse laser light, a shock wave generation part 4 for generating a shock wave, a detection part 5 for detecting the shape of a surface reformed film, and a PC 6 for computing the residual stress from the shape of the detection part 5.
COPYRIGHT: (C)2007,JPO&INPIT
Inventors:
IKEDA RYUJI
CHO HIDEO
TAKEMOTO MIKIO
OGAWA TAKESHI
UCHIYAMA TOMONARI
CHO HIDEO
TAKEMOTO MIKIO
OGAWA TAKESHI
UCHIYAMA TOMONARI
Application Number:
JP2006029139A
Publication Date:
August 23, 2007
Filing Date:
February 07, 2006
Export Citation:
Assignee:
TAMA TLO KK
International Classes:
G01L1/00
Attorney, Agent or Firm:
Hitoshi Suzuki