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Title:
残留応力部分低減方法および残留応力部分低減装置
Document Type and Number:
Japanese Patent JP4578918
Kind Code:
B2
Abstract:

To provide a residual stress part reduction method and a residual stress part reduction device capable of carrying out more precise work on a part of a metal part and carrying out extremely favorable treatment even for treatment where compressed residual stress and tensile residual stress are included.

A residual stress detection process to detect the tensile residual stress of the metal part 1, a residual stress specifying process to specify a stress value, a place and a region of the metal part, a compressed stress giving energy setting process to set a value, a place and a range of compressed stress giving energy to convert the tensile residual stress of a tensile residual stress part to the compressed residual stress in accordance with a data concerning the tensile residual stress and a compressed residual stress giving process to give the compressed residual stress due to cavitation work to the metal part are furnished, and a hone 4 to vibrate in high frequency is relatively traversely moved by interposing liquid in a clearance between the hone and a surface of the tensile residual stress part of the metal part 1 in the compressed residual stress giving process.

COPYRIGHT: (C)2006,JPO&NCIPI


Inventors:
Takashi Ogawara
Goichi Hirota
Kageyama Masakazu
Application Number:
JP2004292690A
Publication Date:
November 10, 2010
Filing Date:
October 05, 2004
Export Citation:
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Assignee:
Toshiba Plant Systems Co., Ltd.
International Classes:
B23P17/00; C21D7/06; C22F3/00
Domestic Patent References:
JP2005002475A
JP7328859A
JP10245625A
JP2000252287A
JP2004174630A
JP2003220523A
JP2002012990A
JP5018833A
Attorney, Agent or Firm:
Hisashi Hatano
Shunguchi Sekiguchi