RESILIENT POLISHING PAD FOR CHEMICAL-MECHANICAL POLISHING

Title:

RESILIENT POLISHING PAD FOR CHEMICAL-MECHANICAL POLISHING

Document Type and Number:

Japanese Patent JP2005167200

Kind Code:

A

Abstract:

To provide a laminated layer type polishing pad for chemical-mechanical polishing which is hard to break away, is low in cost, can be manufactured, and has a window for detecting an end.

The resilient laminated-layer-type polishing pad for chemical-mechanical polishing is disclosed. The polishing pad includes a base layer and polishing layer which are bonded with a hot melt adhesive. The hot melt adhesive has the polishing pad T type peeling strength more than 40 N in 305 mm/ min, and the layer breakaway of pad reduces.

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Inventors:

ROBERTS JOHN V H
VESIER LAURENT S

Application Number:

JP2004279442A

Publication Date:

June 23, 2005

Filing Date:

September 27, 2004

Export Citation:

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Assignee:

ROHM & HAAS ELECT MAT

International Classes:

B24B37/00; B24B29/00; B24B37/04; B24D13/14; H01L21/304; (IPC1-7): H01L21/304; B24B37/00

Domestic Patent References:

JP2001047357A	2001-02-20
JP2003019658A	2003-01-21
JP2003218074A	2003-07-31

Attorney, Agent or Firm:

Hajime Tsukuni
Fumio Shinoda
Koshiro Tsukuda

Previous Patent: JP2005167199

Next Patent: SEMICONDUCTOR MEMORY DEVICE AND ITS MANUFACTURING METHOD