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Patent Searching and Data


Title:
RESIN BASE MATERIAL WITH LIGHT SHIELDING PART, MOLDED RESIN MATERIAL AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2008213146
Kind Code:
A
Abstract:

To provide a resin base material with a light shielding part having high hiding property on a base material made of a synthetic resin without separately adding a material or a complicated manufacturing process for the purpose of concealing.

The light shielding part 11 to which a light shielding color is applied and a display 12, which can be visually confirmed from the other surface side of the base material 1 made of the synthetic resin and is provided within the light shielding part 11, are provided to a predetermined region of one side of the base material 1. By forming the light shielding part 11 of the resin base material having an uneven surface, the resin base material with the light shielding part having high hiding property can be obtained.


Inventors:
SANO DAIYA
Application Number:
JP2007049223A
Publication Date:
September 18, 2008
Filing Date:
February 28, 2007
Export Citation:
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Assignee:
TOMEI KAGAKU KOGYO KK
International Classes:
B32B7/02; B65D65/16; B65D65/40
Attorney, Agent or Firm:
Kaoru Watanabe