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Title:
RESIN COMPOSITION FOR ADHESION, LAMINATE AND DRAWN FILM
Document Type and Number:
Japanese Patent JP3671626
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a resin composition for adhesion, excellent in bond strength to various resins after drawing and in extrusion molding suitability for film, sheet or blow, a laminate using the composition and a drawn film of the laminate.
SOLUTION: This resin composition for adhesion comprises (a) 50-99 wt.% of a modified hydrogenated block copolymer which is obtained by hydrogenating a block copolymer of a vinyl aromatic compound and a conjugated diene compound to give a hydrogenated block copolymer and modifying the hydrogenated block copolymer with an unsaturated carboxylic acid or its derivative and has 0.01-20 wt.% content of the unsaturated carboxylic acid or-its derivative and (b) 1-50 wt.% of a tackifier. The composition is laid various resins to give a laminate, which is drawn to give a drawn film.


Inventors:
Mutsuko Ikeda
Hiroyuki Sato
Application Number:
JP29702597A
Publication Date:
July 13, 2005
Filing Date:
October 29, 1997
Export Citation:
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Assignee:
Mitsubishi Chemical Corporation
International Classes:
B32B27/28; B29C55/12; C08L53/02; C09J153/02; B29L9/00; (IPC1-7): C09J153/02; B32B27/28
Domestic Patent References:
JP3007746A
JP11131037A
JP10286870A
JP4096959A
JP6322346A
JP10265751A
JP10264323A
JP56104978A
JP55013719A
JP10279774A
Foreign References:
US5070143
Attorney, Agent or Firm:
Michiteru Soga
Yoshio Kobayashi
Yutaka Ikeya
Hidetoshi Furukawa
Suzuki Kenchi
Masahisa Hase
Tetsuo Kuroiwa