Title:
RESIN COMPOSITION, ADHESIVE AND FILM ADHESIVE AND LEAD FRAME AND SEMICONDUCTOR DEVICE PREPARED THEREFROM
Document Type and Number:
Japanese Patent JP2000086888
Kind Code:
A
Abstract:
To provide a resin composition, an adhesive and a film adhesive, which are capable of bonding to an adherend at a low temperature, excellent in heat resistance and particularly suitable for fixing inner leads and a lead frame and a semiconductor device prepared therefrom.
This resin composition comprises a copolymer obtained by reacting the following (A), (B) and (C): (A) a dicarboxylic acid, a tricarboxylic acid anhydride or a tetra-carboxylic acid dianhydride, (B) a diamine or a diisocyanate, and (C) an elastomer represented by HOOC-R1-COOH (wherein R1 is a hydrogenated polybutadiene residue, a hydrogenated polyisoprene residue or a polyisobutylene residue.
Inventors:
KAWAI AKIYASU
MATSUURA SHUICHI
NOMURA YOSHIHIRO
MATSUURA SHUICHI
NOMURA YOSHIHIRO
Application Number:
JP25975598A
Publication Date:
March 28, 2000
Filing Date:
September 14, 1998
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H01L23/50; C08G18/34; C08G69/26; C08G73/10; C08L13/00; C08L77/00; C08L79/04; C09J7/02; C09J113/00; C09J177/00; C09J179/04; (IPC1-7): C08L77/00; C08G18/34; C08G69/26; C08L13/00; C08L79/04; C09J7/02; C09J113/00; C09J177/00; C09J179/04
Attorney, Agent or Firm:
Kunihiko Wakabayashi