Title:
樹脂組成物、接着フィルム、プリント配線板及び半導体装置
Document Type and Number:
Japanese Patent JP6672616
Kind Code:
B2
Abstract:
The invention provides a resin composition of an insulating layer which has excellent dielectric loss factor, excellent thermal expansion coefficient, excellent elongation at break, surface roughness and peeling strength. The resin composition comprises the components of (A) epoxy resin, (B) active ester compound, (C) carbodiimide compound, (D) thermoplastic resin and (E) inorganic filling material, wherein when the nonvolatile component in the resin composition is set to 100% by mass, the content of the component (E) is above 40%.
Inventors:
Nishimura Yoshio
Shiro Tatsumi
Shohei Fujishima
Watanabe Masatoshi
Shiro Tatsumi
Shohei Fujishima
Watanabe Masatoshi
Application Number:
JP2015114108A
Publication Date:
March 25, 2020
Filing Date:
June 04, 2015
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; C08G59/40; C08K3/00; C08K5/29; C09J7/30; C09J11/04; C09J11/06; C09J155/00; C09J163/00; C09J175/04; C09J201/02; H01B3/40; H05K1/03
Domestic Patent References:
| JP2013095839A | ||||
| JP2010111859A | ||||
| JP2006176549A | ||||
| JP2006335834A | ||||
| JP2010144121A | ||||
| JP2010202865A | ||||
| JP2004277460A | ||||
| JP2006037083A | ||||
| JP2006335843A |
Foreign References:
| WO2013111345A1 | ||||
| WO2012165012A1 |
Attorney, Agent or Firm:
Sakai International Patent Office