Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION AND ADHESIVE FOR POLYWOOD USING THE SAME
Document Type and Number:
Japanese Patent JP2000204106
Kind Code:
A
Abstract:

To obtain a resin composition affecting no bad influence to human bodies and environments and having performance with little reduction of adhesive force against a high temperature hot water and provide adhesives for polywoods containing the same.

This resin composition comprises a vinyl acetate-acrylic acid copolymer resin emulsion or a vinyl acetate(meth)acrylic acid ester-acrylic acid copolymer resin emulsion obtained by polymerizing 80.0-99.9 wt.% of (i) vinyl acetate or vinyl acetate and (meth)acrylic acid ester and 0.1-20 wt.% of (ii) acrylic acid as a main component in the presence of a modified polyvinyl alcohol-based copolymer containing 1-10 mole % of ≤4C α-olefin units in a molecule.


Inventors:
Uchida, Jiro
Mise, Tsuyoshi
Nakamura, Kimihiko
Nishiike, Haruki
Application Number:
JP1999000004046
Publication Date:
July 25, 2000
Filing Date:
January 11, 1999
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHOWA HIGHPOLYMER CO LTD
International Classes:
C08F2/24; C08F2/44; C08F218/08; C08F220/06; C08F220/12; C09J131/04; C09J133/06; C08F2/12; C08F2/44; C08F218/00; C08F220/00; C09J131/00; C09J133/06; (IPC1-7): C08F2/24; C08F2/44; C08F218/08; C08F220/06; C08F220/12; C09J131/04; C09J133/06