Title:
RESIN COMPOSITION AND ADHESIVE
Document Type and Number:
Japanese Patent JP2016138220
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition having high adhesive strength, and an adhesive prepared with the resin composition, where the adhesive is heat resistant and has high adhesiveness in a wide range from low to high temperatures.SOLUTION: A resin composition comprises a matrix resin (A), a curing agent (B), and a fibrillated resin composition (C) comprising cellulose nanofiber where the matrix resin (A) comprises an epoxy resin, and the content of the cellulose nanofiber is 0.1-10 mass% relative to the total content of the resin composition.SELECTED DRAWING: None
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Inventors:
HAMADA KENICHI
YAMAZAKI TAKESHI
YAMAZAKI TAKESHI
Application Number:
JP2015015375A
Publication Date:
August 04, 2016
Filing Date:
January 29, 2015
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C08L63/00; C08G59/44; C08K5/315; C08K7/02; C08L1/00; C09J11/06; C09J11/08; C09J163/00
Domestic Patent References:
| JP2013116928A | 2013-06-13 | |||
| JP2016006131A | 2016-01-14 |
Foreign References:
| WO2013147062A1 | 2013-10-03 | |||
| WO2013122209A1 | 2013-08-22 | |||
| WO2013147063A1 | 2013-10-03 | |||
| WO2012043558A1 | 2012-04-05 |
Attorney, Agent or Firm:
Kono Tsuyo
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