Title:
RESIN COMPOSITION AND AQUEOUS RESIN COMPOSITION CONTAINING THE RESIN COMPOSITION, AND CURED MATERIAL USING THE RESIN COMPOSITION AND THE AQUEOUS RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2000109632
Kind Code:
A
Abstract:
To provide a resin compsn. and an aqueous resin compsn. applicable in broad use such as a paint, ink, adhesive, and a sealing agent.
This resin compsn. contains a polymer (A) obtd. by copolymerizing an ethylenic unsaturated monomer compsn. contg. an ethylenic unsaturated monomer having two carboxylic acid groups in a molecule (a), and an ethylenic unsaturated monomer having at least a hydroxide group in a molecule (b), and a compd. (B) having at least a triazine ring and/or a guanidino group in a molecule.
Inventors:
SUZUKI YOSHIKO
YOSHIDA MITSUO
YOSHIDA MITSUO
Application Number:
JP28185898A
Publication Date:
April 18, 2000
Filing Date:
October 05, 1998
Export Citation:
Assignee:
TOYO INK MFG CO
International Classes:
C09K3/10; C08L33/14; C08L35/00; C08L61/26; C09D7/12; C09D133/14; C09D135/00; C09D161/26; C09J133/14; C09J135/00; C09J161/26; (IPC1-7): C08L35/00; C08L33/14; C08L61/26; C09D7/12