Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION FOR BONDING AND LAMINATE MADE BY USING IT AS ADHESIVE LAYER
Document Type and Number:
Japanese Patent JPH03106979
Kind Code:
A
Abstract:

PURPOSE: To provide a resin composition for bonding, excellent in high- temperature adhesiveness, etc., by mixing a styrenic elastomer with a polyethylene grafted with a specified amount of an unsaturated carboxylic acid (derivative).

CONSTITUTION: 100 pts.wt. flexible polymer comprising a styrenic elastomer is mixed with 1-30 pts.wt. graft polyethylene partly or wholly grafted with 0.05-15wt.% unsaturated carboxylic acid (derivative) (e.g. maleic anhydride) to produce a resin composition for bonding. The use of this composition for bonding, for example, between a polyethylene terephthalate layer and a saponified ethylene/vinyl acetate copolymer layer can produce a laminate free from delamination even under high temperature conditions, for instance, when it is treated in a retort, having low gas permeability, and suitable for food packaging material, etc.


Inventors:
MITO MASAHARU
NAKAGAWA MIKIO
Application Number:
JP24277589A
Publication Date:
May 07, 1991
Filing Date:
September 19, 1989
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUI PETROCHEMICAL IND
International Classes:
B32B27/08; B32B7/12; B32B27/28; C08J5/12; C09J123/08; C09J151/00; C09J151/06; C09J153/00; C09J153/02; (IPC1-7): B32B7/12; B32B27/08; B32B27/28; C08J5/12; C09J151/06; C09J153/02
Domestic Patent References:
JPS61296044A1986-12-26
JPS5871972A1983-04-28
JPS5426841A1979-02-28
JPH0368640A1991-03-25
Attorney, Agent or Firm:
Shunichiro Suzuki



 
Previous Patent: JPH03106978

Next Patent: LIQUID SUPPLY METERING PUMP