Title:
耐チッピング用樹脂組成物
Document Type and Number:
Japanese Patent JP4323330
Kind Code:
B2
Abstract:
To provide a resin composition excellent in compatibility, dispersibility, storage stability, etc., capable of expressing resistance to chipping even reducing thickness of an interlayer by using as a primer, usable as an intermediate coating which has a property resistant to chipping, by mixing the resin composition with an intermediate coating.
The resin comprises (A) a thermoplastic elastomer, and (B) copolymerizable monomers comprising a monomer having an α, β-unsaturated ethylenic unsaturated group and other copolymerizable monomer. The resin composition comprises the resin and organic solvents.
COPYRIGHT: (C)2004,JPO&NCIPI
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Inventors:
Keiichi Asami
Application Number:
JP2004004844A
Publication Date:
September 02, 2009
Filing Date:
January 09, 2004
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08L51/04; C08F255/02; C08K5/00; C09D7/12; C09D123/04; C09D123/14; C09D123/18; C09D151/00; C09D153/02
Domestic Patent References:
| JP10287843A | ||||
| JP9208882A | ||||
| JP4013747A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda