RESIN COMPOSITION COMPRISING IMIDAZOLE SILANE COMPOUND AND USE THEREOF

Title:

RESIN COMPOSITION COMPRISING IMIDAZOLE SILANE COMPOUND AND USE THEREOF

Document Type and Number:

Japanese Patent JP2016014084

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a resin composition that provides a cured product or a molded product having excellent adhesion to metal and inorganic materials.SOLUTION: The present invention provides a resin composition comprising an imidazole silane compound represented by chemical formula (I), and resin (where R-Rare H, a C1-20 alkyl group or a phenyl group; Rand Rare H or a C1-3 alkyl group; m is an integer of 1-3; n is an integer of 0-5).

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Inventors:

TAKASAKU KOJI

Application Number:

JP2014135531A

Publication Date:

January 28, 2016

Filing Date:

July 01, 2014

Export Citation:

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Assignee:

SHIKOKU CHEM

International Classes:

C08L101/00; B32B5/28; C08J5/24; C08K5/544; C08L61/06; C08L63/00; C08L75/04; C09D161/04; C09D163/00; C09D175/04; C09D183/08; C09J161/04; C09J163/00; C09J175/04; C09J183/08; C09K3/10; H01L21/52; H01L23/29; H01L23/31

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