Title:
RESIN COMPOSITION AND CROSSLINKED BODY OF THE SAME
Document Type and Number:
Japanese Patent JP2018058989
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition capable of obtaining a crosslinked body excellent in dielectric characteristics, heat resistance and mechanical characteristics in a high frequency region suitable for an interlaminar insulation film for circuit board for highly integrated arithmetic device and a circuit board, and the like.SOLUTION: A resin composition contains a cyclic olefin copolymer (P), an epoxy resin (Q) and a compatibilizer (R). A mass ratio ((Q)/(P)) of a content of the epoxy resin (Q) to a content of the cyclic olefin copolymer (P) in the resin composition is 0.2 or more and 5 or less, and the cyclic olefin copolymer (P) contains a cyclic olefin copolymer (m) and a cyclic olefin copolymer (n) different from the cyclic olefin copolymer (m). When the total of the cyclic olefin copolymer (m) and the cyclic olefin copolymer (n) contained in the resin composition is 100 mass%, a content of the cyclic olefin copolymer (m) is 5 mass% or more and 95 mass% or less, and a content of the cyclic olefin copolymer (n) is 5 mass% or more and 95 mass% or less.SELECTED DRAWING: None
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Inventors:
SAITO JUNJI
ASAHINA KOTARO
MURASE HIROHIKO
SAITO HARUKA
ASAHINA KOTARO
MURASE HIROHIKO
SAITO HARUKA
Application Number:
JP2016197192A
Publication Date:
April 12, 2018
Filing Date:
October 05, 2016
Export Citation:
Assignee:
MITSUI CHEMICALS INC
International Classes:
C08L23/00; C08F20/18; C08F22/06; C08L33/02; C08L63/00; H05K1/03
Domestic Patent References:
| JP2014101503A | 2014-06-05 | |||
| JP2016017089A | 2016-02-01 |
Attorney, Agent or Firm:
Shinji Hayami
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