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Patent Searching and Data


Title:
RESIN COMPOSITION AND CROSSLINKED BODY THEREOF
Document Type and Number:
Japanese Patent JP2018090689
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition that makes it possible to obtain a crosslinked body having excellent dielectric properties, heat resistance and mechanical properties in a high frequency region, suitable for an interlayer insulation film for a circuit board aimed at a high-density arithmetic unit, a circuit board and the like.SOLUTION: A resin composition contains a cyclic olefin copolymer (P) and an epoxy resin (Q). In the resin composition, a mass ratio of the epoxy resin (Q) content to the cyclic olefin copolymer (P) content, ((Q)/(P)), is 0.1 or more and 5 or less.SELECTED DRAWING: None

Inventors:
SAITO JUNJI
ASAHINA KOTARO
MURASE HIROHIKO
SAITO HARUKA
Application Number:
JP2016234331A
Publication Date:
June 14, 2018
Filing Date:
December 01, 2016
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
C08L23/20; C08F232/08; C08J3/24; C08J5/24; C08L63/00; H05K1/03
Attorney, Agent or Firm:
速水 進治