To enable the roughening of the surface of a resist by acid or alkali solvent treatment after curing.
This resin composition is prepd. by blending 30-60 pts.wt. at least one kind of ethylenic unsatd. compd. having two or more (meth)acryloyloxy groups in one molecule with 30-60 pts.wt. polymer for a binder contg. 15-30wt.% at least one kind of α,β-unsatd. carboxyl group-contg. monomer and 5-30wt.% at least one kind of hydroxyl group-contg. monomer, 10-30 pts.wt. water-soluble polymer for a binder contg. 10-40wt.% hydroxyl group-contg. monomer and 1-20 pts.wt. block polyisocyanate compd., and 100 pts.wt. of the composition is further blended with 0.001-10 pts.wt. photopolymn. initiator to obtain the objective resin compsn. In order to ensure a sufficiently large film thickness on a pattern, the resin compsn. is used in the form of a dry film resist using a substrate film having a roughened surface.
FUJIWARA TADAYUKI
SENDA KAZUMI
NOMI HARUICHI
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